starfireprime Posted February 2, 2015 Report Share Posted February 2, 2015 I have Flirc's Pi case for my Model B+ and really love the product. I've noticed that for the newly announced Pi 2, the Broadcom chip appears slightly larger, although in the same location on the board. Any thoughts on thermal issues if the Pi Case's aluminum heat sink only covers a majority, but not the entire surface of the chip? I'm guessing no, but I thought I'd ask. :) 1 Quote Link to comment Share on other sites More sharing options...
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