April 8, 20188 yr comment_15116 I read in a review on Amazon that the heatsink/heat transfer post is hollow. Is this indeed the case? Also, I've seen reference to a 3rd gen case, but the Amazon description states "gen2." What generation is the newest shipping version? Thank you for your attention to this. Regards, Report
April 8, 20188 yr comment_15118 The post is hollow, but this doesn't impede the heat transfer in any significant way. The post itself may have less heat capacity, than a solid block, but the whole case acts as a heat sink and heat spreader so the heat from the CPU is dissipated quickly enough. Report
April 9, 20188 yr comment_15120 no need for a third generation case. This case is compatible with the pi3 B+, has a new thermal pad to accommodate the height difference. Report
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