Pheckphul Posted December 26, 2015 Report Posted December 26, 2015 I recently bought a Flirc case and received a rev. 3. I want to use this with a Pi 2. I'm curious about the design/manufacturing tolerances. I want to use thermal paste instead of the included pad. Does the heatsink/post come into full contact with the Pi 2's processor, or is there too great of a gap? Quote
jason Posted December 26, 2015 Report Posted December 26, 2015 The case doesn't come close enough to the processor. There are a few manufactures of the pi2 plus it's gotta support the B+ as well. Quote
Pheckphul Posted December 26, 2015 Author Report Posted December 26, 2015 The case doesn't come close enough to the processor. There are a few manufactures of the pi2 plus it's gotta support the B+ as well. That bytes. Do you know how wide the gap is? I'd rather bridge it with copper shims than a thermal pad. I think a copper shim of the appropriate thickness would stay in place merely by being sandwiched between the CPU and the CPU post once the Pi 2 is screwed into the case. Quote
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