Pheckphul 0 Report post Posted April 8, 2018 I read in a review on Amazon that the heatsink/heat transfer post is hollow. Is this indeed the case? Also, I've seen reference to a 3rd gen case, but the Amazon description states "gen2." What generation is the newest shipping version? Thank you for your attention to this. Regards, Share this post Link to post Share on other sites
yawor 83 Report post Posted April 8, 2018 The post is hollow, but this doesn't impede the heat transfer in any significant way. The post itself may have less heat capacity, than a solid block, but the whole case acts as a heat sink and heat spreader so the heat from the CPU is dissipated quickly enough. Share this post Link to post Share on other sites
Pheckphul 0 Report post Posted April 8, 2018 Cool. Thanks for your answer. Share this post Link to post Share on other sites
jason 145 Report post Posted April 9, 2018 no need for a third generation case. This case is compatible with the pi3 B+, has a new thermal pad to accommodate the height difference. Share this post Link to post Share on other sites
