Leaderboard

I have Flirc's Pi case for my Model B+ and really love the product. I've noticed that for the newly announced Pi 2, the Broadcom chip appears slightly larger, although in the same location on the board. Any thoughts on thermal issues if the Pi Case's aluminum heat sink only covers a majority, but not the entire surface of the chip? I'm guessing no, but I thought I'd ask. :)

There won't be any issues. We tested a few weeks ago. While the chip is a little bigger, the heat sink will do as its intended. The hot spot won't be at the end of the chip.

The biggest difference in layout between RPi B+ and RPi 2.0 B is not the CPU placement but the RAM placement. On pre-2.0 boards RAM is mounted on top of the CPU. On 2.0 board the RAM is on the other side of the board. Because of that the CPU on the 2.0 board is thinner than the CPU+RAM on pre-2.0 boards. I don't know how the thermal pad looks in the Flirc RPi case (I don't have one yet as I don't have RPi B+) but there is a risk that it won't even touch the CPU because of its thickness rather than the position or its size.