Pheckphul Posted April 8, 2018 Report Share Posted April 8, 2018 I read in a review on Amazon that the heatsink/heat transfer post is hollow. Is this indeed the case? Also, I've seen reference to a 3rd gen case, but the Amazon description states "gen2." What generation is the newest shipping version? Thank you for your attention to this. Regards, Quote Link to comment Share on other sites More sharing options...
yawor Posted April 8, 2018 Report Share Posted April 8, 2018 The post is hollow, but this doesn't impede the heat transfer in any significant way. The post itself may have less heat capacity, than a solid block, but the whole case acts as a heat sink and heat spreader so the heat from the CPU is dissipated quickly enough. Quote Link to comment Share on other sites More sharing options...
Pheckphul Posted April 8, 2018 Author Report Share Posted April 8, 2018 Cool. Thanks for your answer. Quote Link to comment Share on other sites More sharing options...
jason Posted April 9, 2018 Report Share Posted April 9, 2018 no need for a third generation case. This case is compatible with the pi3 B+, has a new thermal pad to accommodate the height difference. Quote Link to comment Share on other sites More sharing options...
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