Pheckphul Posted December 26, 2015 Report Share Posted December 26, 2015 I recently bought a Flirc case and received a rev. 3. I want to use this with a Pi 2. I'm curious about the design/manufacturing tolerances. I want to use thermal paste instead of the included pad. Does the heatsink/post come into full contact with the Pi 2's processor, or is there too great of a gap? Quote Link to comment Share on other sites More sharing options...
jason Posted December 26, 2015 Report Share Posted December 26, 2015 The case doesn't come close enough to the processor. There are a few manufactures of the pi2 plus it's gotta support the B+ as well. Quote Link to comment Share on other sites More sharing options...
Pheckphul Posted December 26, 2015 Author Report Share Posted December 26, 2015 The case doesn't come close enough to the processor. There are a few manufactures of the pi2 plus it's gotta support the B+ as well. That bytes. Do you know how wide the gap is? I'd rather bridge it with copper shims than a thermal pad. I think a copper shim of the appropriate thickness would stay in place merely by being sandwiched between the CPU and the CPU post once the Pi 2 is screwed into the case. Quote Link to comment Share on other sites More sharing options...
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