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Pheckphul

Flirc Case Rev. 3 + thermal paste = ?

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I recently bought a Flirc case and received a rev. 3. I want to use this with a Pi 2. I'm curious about the design/manufacturing tolerances. I want to use thermal paste instead of the included pad. Does the heatsink/post come into full contact with the Pi 2's processor, or is there too great of a gap?

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The case doesn't come close enough to the processor. There are a few  manufactures of the pi2 plus it's gotta support the B+ as well.

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The case doesn't come close enough to the processor. There are a few  manufactures of the pi2 plus it's gotta support the B+ as well.

 

 

 

That bytes. Do you know how wide the gap is? I'd rather bridge it with copper shims than a thermal pad. I think a copper shim of the appropriate thickness would stay in place merely by being sandwiched between the CPU and the CPU post once the Pi 2 is screwed into the case.

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