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Pheckphul

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Posts posted by Pheckphul


  1. On 3/23/2018 at 7:55 AM, jason said:

    0.4mm thermal pads will be included in the next build of the case, which is happening now, I have 0.4 mm on their way to me and distributors to ship standalone as well. It's been in the works for a couple weeks now.

    You can use the case without a pad until they arrive, it's safe.

    You say "next build of the case." Does this mean manufacturing run, or is a new version (gen 4?) of the case being released imminently?

    When do you anticipate availability?

     


  2. The case doesn't come close enough to the processor. There are a few  manufactures of the pi2 plus it's gotta support the B+ as well.

     

     

     

    That bytes. Do you know how wide the gap is? I'd rather bridge it with copper shims than a thermal pad. I think a copper shim of the appropriate thickness would stay in place merely by being sandwiched between the CPU and the CPU post once the Pi 2 is screwed into the case.

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