Pheckphul
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Posts posted by Pheckphul
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Great! Again, cool. Literally.
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Cool. Thanks for your answer.
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I read in a review on Amazon that the heatsink/heat transfer post is hollow. Is this indeed the case?
Also, I've seen reference to a 3rd gen case, but the Amazon description states "gen2." What generation is the newest shipping version?
Thank you for your attention to this.
Regards,
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On 3/23/2018 at 7:55 AM, jason said:
0.4mm thermal pads will be included in the next build of the case, which is happening now, I have 0.4 mm on their way to me and distributors to ship standalone as well. It's been in the works for a couple weeks now.
You can use the case without a pad until they arrive, it's safe.
You say "next build of the case." Does this mean manufacturing run, or is a new version (gen 4?) of the case being released imminently?
When do you anticipate availability?
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The case doesn't come close enough to the processor. There are a few manufactures of the pi2 plus it's gotta support the B+ as well.
That bytes. Do you know how wide the gap is? I'd rather bridge it with copper shims than a thermal pad. I think a copper shim of the appropriate thickness would stay in place merely by being sandwiched between the CPU and the CPU post once the Pi 2 is screwed into the case.
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I recently bought a Flirc case and received a rev. 3. I want to use this with a Pi 2. I'm curious about the design/manufacturing tolerances. I want to use thermal paste instead of the included pad. Does the heatsink/post come into full contact with the Pi 2's processor, or is there too great of a gap?
Should we expect a new Flirc case for the RPi 4?
in General Questions
Posted · Edited by Pheckphul
Should we expect an update to the Flirc case for the RPi 4 with cooling for the USB controller?