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Everything posted by devnull22

  1. Received the paste yesterday, going to try it out tonight. Have 2 pi3 with flirc cases, both behaved the same way when under 4 core full load temp wise, so will only put the paste in one and switch sd card and do the same test in the other pi3 then!
  2. Sorry to bump that topic back up, but since it's kind of related to what I am attempting to do, I'll test the waters here and see if it's a good or a bad idea ;-) For bridging the gap for a raspi 3 with a flirc case (for a raspi 2 when it came out), the thermal pad that came with the case seems to be a bit thin. I was about to order a bigger pad as no electronics store near home sell any, and was wondering if this product would be a better fit: - K5 PRO viscous thermal paste Seems like a paste that transfers heat well and would be sure to bridge the gap perfectly for optimal heat transfer? As the pi3 won't be leaving the case once I'm done, I don't mind leaving it on without being able to change the boards in the case. Anyone have any ideas as to if it would be a good/bad thing? If not, I'll probably order and try it out, and post back here with my findings with a series of tests for cpu temps.
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