Sorry to bump that topic back up, but since it's kind of related to what I am attempting to do, I'll test the waters here and see if it's a good or a bad idea ;-) For bridging the gap for a raspi 3 with a flirc case (for a raspi 2 when it came out), the thermal pad that came with the case seems to be a bit thin. I was about to order a bigger pad as no electronics store near home sell any, and was wondering if this product would be a better fit: - K5 PRO viscous thermal paste Seems like a paste that transfers heat well and would be sure to bridge the gap perfectly for optimal heat transfer? As the pi3 won't be leaving the case once I'm done, I don't mind leaving it on without being able to change the boards in the case. Anyone have any ideas as to if it would be a good/bad thing? If not, I'll probably order and try it out, and post back here with my findings with a series of tests for cpu temps.