[Pi Case and Raspberry Pi 2 Broadcom die size]

@DocG - thanks.  I'll try a 1.5mm pad and some stress tests to see how it works!

 

Edit:

 

Picked up a T-Flex 15mmx15mmx1.5mm pad off of ebay.  It fully covered the cpu.  I sanded off the paint on the post to expose the aluminum and gave it a shot.  Although the pad may have been touching the post slightly, I was unconvinced that there was good contact since the board still rocked out pretty easily.

 

So I took a rotary tool to the four screw posts to shorten then up a bit, reinstalled the board and was reasonably pleased there was contact between the pad and the post. 

 

Some stress numbers

 

Ambient ~ 64F  ~ 18C

 

Idle           29.3C

1 thread   32.6C

2              34.7C

3              36.9C

4              38.8C

 

So about 2.2 degC per loaded core and better overall performance.

[Pi Case and Raspberry Pi 2 Broadcom die size]

Just a follow up - I received my Pi 2 today and already had my Flirc case.  The board fits fine in the case, but it did not appear as if the thermal pad made contact with the heatsink post at all.  The board easily rocked out of the case when I turned it on its side suggesting that there was not adhesion to the pad at all.  Also as DocG noted, the post is noticeably off center.

 

For now, I removed the pad an am just running the board in the case.

 

EDIT:

 

Without the thermal pad contact, temps run a little hotter (as one might expect with less air circulation and no direct thermal transfer).  My unscientific measurements:

 

                    In Case                 Alone (68F room)

Idle               40-42C                   38C

1 busy core     45C                     44C

2                      50C                    49C

3                      55C                    54C

4                      60C                    57.5C

[Pi Case and Raspberry Pi 2 Broadcom die size]

There won't be any issues. We tested a few weeks ago. While the chip is a little bigger, the heat sink will do as its intended. The hot spot won't be at the end of the chip.

 

Thanks Jason.  Any thoughts/observations on yawor's comment as to the height of the CPU off of the board and the thickness of the thermal pad?  I don't recall the thickness of the pad in the case that I already received.

[Pi Case and Raspberry Pi 2 Broadcom die size]

I have Flirc's Pi case for my Model B+ and really love the product.  I've noticed that for the newly announced Pi 2, the Broadcom chip appears slightly larger, although in the same location on the board. 

 

Any thoughts on thermal issues if the Pi Case's aluminum heat sink only covers a majority, but not the entire surface of the chip?  I'm guessing no, but I thought I'd ask.  :)