bri0528
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Posts posted by bri0528
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I have the rev3 case and just picked up the RP 3B+. I think the issue is that the CPU in the new model is maybe 1-1.5mm taller than the 3B. So the new Pi will fit in the FLIRC, but I bet the thermal pad will need to be thinner. From poking around, it looks like the current pad is 1.5mm, so I'm guessing a thermal pad around 0.5-1.0mm would be better to minimize compression. Here are pics for the 3B and 3B+ from www.raspberrypi.org.
Flirc Case compatibility
in General Questions
Posted
It's tough to see anything as the board gets close to the case. I've been trying to figure out what to use as well. I used a small piece of play-doh on the CPU and compressed it when closing the case, and from that compression thickness I'm guessing the gap is less than a 0.5 mm, so some thermal paste maybe the way to go, or at least a compressed 0.5mm thermal pad.